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1K x 18 / 2K x 9 SuperSync II FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PN80
Lead Count (#):80
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.65

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeNo
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)80
Carrier TypeTray
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)18
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)166 - 166
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ25
Moisture Sensitivity Level (MSL)3
Organization1K x 18, 2K x 9
Package Area (mm²)196
Pb (Lead) FreeNo
Pb Free Categorye0
Pitch (mm)0.65
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
PublishedNo
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14

Description

The 72V233 2K x 9/1K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.