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256K x 18 SuperSync FIFO, 3.3V

Package Information

CAD Model: View CAD Model
Pkg. Type: TQFP
Pkg. Code: PNG64
Lead Count (#): 64
Pkg. Dimensions (mm): 14.0 x 14.0 x 1.4
Pitch (mm): 0.8

Environmental & Export Classifications

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) EAR99
HTS (US) 8542.32.0071

Product Attributes

Lead Count (#) 64
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Country of Assembly TAIWAN
Country of Wafer Fabrication TAIWAN, USA
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 3.3
Density (Kb) 4096
Family Name SuperSync
I/O Frequency (MHz) 100 - 100
I/O Type 3.3 V LVTTL
Interface Synchronous
Length (mm) 14
MOQ 45
Organization 256K x 18
Package Area (mm²) 196
Pb Free Category e3 Sn
Pitch (mm) 0.8
Pkg. Dimensions (mm) 14.0 x 14.0 x 1.4
Pkg. Type TQFP
Price (USD) $189.55844
Published No
Qty. per Carrier (#) 90
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 70°C
Thickness (mm) 1.4
Width (mm) 14

Description

The 72V2105 is an 256K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.