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128K x 18 / 256K x 9 TeraSync FIFO, 2.5V

Package Information

CAD Model: View CAD Model
Pkg. Type: PBGA
Pkg. Code: BB240
Lead Count (#): 240
Pkg. Dimensions (mm): 19.0 x 19.0 x 1.76
Pitch (mm): 1

Environmental & Export Classifications

Pb (Lead) Free No
Moisture Sensitivity Level (MSL) 3
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#) 240
Pb (Lead) Free No
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 2.5
Density (Kb) 2048
Family Name TeraSync
Function Bus Matching, JTAG, Mark & Retransmit
I/O Frequency (MHz) 150 - 150
I/O Type 1.5 V HSTL, 1.8 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL
Interface Synchronous
Length (mm) 19
MOQ 25
Organization 128K x 18, 256K x 9
Package Area (mm²) 361
Pb Free Category e0
Pitch (mm) 1
Pkg. Dimensions (mm) 19.0 x 19.0 x 1.76
Pkg. Type PBGA
Price (USD) $149.9272
Published No
Qty. per Carrier (#) 84
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 70°C
Thickness (mm) 1.76
Width (mm) 19

Description

The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.