Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TQFP |
| Pkg. Code: | PK128 |
| Lead Count (#): | 128 |
| Pkg. Dimensions (mm): | 20.0 x 14.0 x 1.4 |
| Pitch (mm): | 0.5 |
Environmental & Export Classifications
| Pb (Lead) Free | No |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Lead Count (#) | 128 |
| Pb (Lead) Free | No |
| Carrier Type | Tray |
| Architecture | Bi-directional |
| Bus Width (bits) | 36 |
| Core Voltage (V) | 5 |
| Density (Kb) | 512 |
| Family Name | Triple-Bus FIFO |
| Function | Bus Matching |
| I/O Frequency (MHz) | 66 - 66 |
| I/O Type | 5.0 V TTL |
| Interface | Synchronous |
| Length (mm) | 20 |
| MOQ | 36 |
| Moisture Sensitivity Level (MSL) | 3 |
| Organization | 8K x 36 x 2 |
| Package Area (mm²) | 280 |
| Pb Free Category | e0 |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 20.0 x 14.0 x 1.4 |
| Pkg. Type | TQFP |
| Published | No |
| Qty. per Carrier (#) | 72 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | 0 to 70°C |
| Thickness (mm) | 1.4 |
| Width (mm) | 14 |
Resources for 723676
Description
The 723676 is a 8K x 36 x 2 Triple Bus sync FIFO memory has two independent dual-port SRAM FIFOs on board each chip that can buffer data between a bidirectional 36-bit bus and two unidirectional 18-bit buses. FIFO data can be read and written using either 18-bit or 9-bit formats with a choice of Big- or Little-Endian configurations. Communication between each port may bypass the FIFOs via two mailbox registers. This device can operate in the IDT Standard mode or the first word fall through mode.