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Renesas Electronics Corporation
3.3V 128K x 8 Asynchronous Static RAM Center Power & Ground Pinout

Package Information

CAD Model:View CAD Model
Pkg. Type:TSOP
Pkg. Code:PHG32
Lead Count (#):32
Pkg. Dimensions (mm):20.95 x 10.16 x 1.0
Pitch (mm):1.27

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)3A991.b.2.a
HTS (US)8542.32.0041

Product Attributes

Lead Count (#)32
Pb (Lead) FreeYes
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
Access Time (ns)15
ArchitectureAsynchronous
Bus Width (bits)8
Core Voltage (V)3.3V
Density (Kb)1024
I/O Voltage (V)3.3 - 3.3
Length (mm)20.95
MOQ1500
Organization128K x 8
Package Area (mm²)212.9
Pb Free Categorye3 Sn
Pitch (mm)1.27
Pkg. Dimensions (mm)20.95 x 10.16 x 1.0
Pkg. TypeTSOP
PublishedNo
Qty. per Carrier (#)0
Qty. per Reel (#)1500
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)-40 to 85°C
Thickness (mm)1
Width (mm)10.16

Description

The 71V124 3.3V CMOS SRAM is organized as 128K x 8. The JEDEC center power/GND pinout reduces noise generation and improves system performance. All bidirectional inputs and outputs of the 71V124 are LVTTL-compatible and operation is from a single 3.3V supply. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation.