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1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM

Package Information

CAD Model:View CAD Model
Pkg. Type:CABGA
Pkg. Code:BPG256
Lead Count (#):256
Pkg. Dimensions (mm):17.0 x 17.0 x 1.76
Pitch (mm):1

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0041

Product Attributes

Lead Count (#)256
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureDual-Port
Bus Width (bits)36
Core Voltage (V)2.5
Density (Kb)36864
FunctionInterrupt, Sleep Mode
I/O Frequency (MHz)133 - 133
I/O Type2.5 V LVTTL, 3.3 V LVTTL
InterfaceSync
Length (mm)17
MOQ18
Organization1024K x 36
Output TypeFlowthrough, Pipelined
Package Area (mm²)289
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)17.0 x 17.0 x 1.76
Pkg. TypeCABGA
Price (USD)$672.80167
PublishedNo
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.76
Width (mm)17

Description

The 70T3509M is a high-speed 1024K x 36-bit synchronous dual-port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power-down feature, controlled by the Chip Enable (CE0 and CE1) permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3509M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.