Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | PGG20 |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 6.5 x 4.4 x 1.0 |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Lead Count (#) | 20 |
| Carrier Type | Tube |
| Moisture Sensitivity Level (MSL) | 1 |
| Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 74 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | 0 to 70°C |
| Country of Assembly | PHILIPPINES, TAIWAN |
| Country of Wafer Fabrication | SINGAPORE |
| Advanced Features | Spread Spectrum |
| App Jitter Compliance | PCIe Gen1, PCIe Gen2 |
| Architecture | Common |
| C-C Jitter Max P-P (ps) | 100 |
| C-C Jitter Typ P-P (ps) | 65 |
| Core Voltage (V) | 3.3 |
| Diff. Output Signaling | HCSL |
| Diff. Outputs | 4 |
| Diff. Termination Resistors | 16 |
| Input Freq (MHz) | 25 - 25 |
| Input Type | Crystal, LVCMOS |
| Inputs (#) | 1 |
| Length (mm) | 6.5 |
| MOQ | 222 |
| Output Banks (#) | 1 |
| Output Freq Range (MHz) | 100 - 100, 200 - 200 |
| Output Skew (ps) | 50 |
| Output Type | HCSL |
| Output Voltage (V) | 3.3 |
| Outputs (#) | 4 |
| PLL | Yes |
| Package Area (mm²) | 28.6 |
| Phase Jitter Max RMS (ps) | 3 |
| Phase Jitter Typ RMS (ps) | 0.76 |
| Pitch (mm) | 0.65 |
| Pkg. Dimensions (mm) | 6.5 x 4.4 x 1.0 |
| Pkg. Type | TSSOP |
| Power Consumption Typ (mW) | 413 |
| Price (USD) | $2.871 |
| Product Category | PCI Express Clocks |
| Prog. Clock | No |
| Reference Output | No |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Spread Spectrum | Yes |
| Supply Voltage (V) | 3.3 - 3.3 |
| Tape & Reel | No |
| Thickness (mm) | 1 |
| Width (mm) | 4.4 |
| Xtal Freq (MHz) | 25 - 25 |
Resources for 5V41066
Description
The 5V41066 is a PCIe Gen2 compliant spread-spectrum-capable clock generator. The device has 4 differential HCSL outputs and can be used in communication or embedded systems to substantially reduce electro-magnetic interference (EMI). The spread amount and output frequency are selectable via select pins.
