Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | SOIC |
| Pkg. Code: | DCG8 |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 4.9 x 3.9 x 1.5 |
| Pitch (mm): | 1.27 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Lead Count (#) | 8 |
| Carrier Type | Tube |
| Moisture Sensitivity Level (MSL) | 1 |
| Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 97 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | 0 to 70°C |
| Advanced Features | Feedback Input |
| Core Voltage (V) | 3.3V, 5V |
| Feedback Input | Yes |
| Input Freq (MHz) | 10 - 80 |
| Input Type | LVCMOS |
| Inputs (#) | 1 |
| Length (mm) | 4.9 |
| MOQ | 3007 |
| Output Banks (#) | 1 |
| Output Freq Range (MHz) | 10 - 80 |
| Output Skew (ps) | 600 |
| Output Type | LVCMOS |
| Output Voltage (V) | 3.3V, 5V |
| Outputs (#) | 1 |
| Package Area (mm²) | 19.1 |
| Period Jitter Typ P-P (ps) | 100 |
| Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 4.9 x 3.9 x 1.5 |
| Pkg. Type | SOIC |
| Product Category | Zero Delay Buffers |
| Prog. Clock | No |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Thickness (mm) | 1.5 |
| Width (mm) | 3.9 |
Resources for 2402
Description
The 2402 is a high-performance Zero Delay Buffer (ZDB) which integrates IDT's proprietary analog/digital Phase-Locked Loop (PLL) techniques. The chip is part of IDT's ClockBlocksTM family and was designed as a performance upgrade to meet today's higher speed and lower voltage requirements. The zero delay feature means that the rising edge of the input clock aligns with the rising edges of both output clocks, giving the appearance of no delay through the device. The 2402 is ideal for synchronizing outputs in a large variety of systems, from personal computers to data communications to graphics/video. By allowing off-chip feedback paths, the device can eliminate the delay through other devices.