Skip to main content

The following page content corresponds to the products marketed in Japan.
If you do not live in Japan, please

Cellular Phone

Overview

New models of cellular phones are expected to provide ever more sophisticated functionality as communication speeds increase, camera pixel counts rise, LCD displays increase in size and resolution. There is a growing demand for features such as the ability to receive and record 1seg TV broadcasts and to handle electronic distribution of video and audio content. Consequently, low power consumption is critical in order to maintain adequate operating time when the user is communicating or the phone is in standby mode. Also, the control functions must be compact so handsets can be thinner and weigh less.

Renesas Electronics supplies a broad lineup of products for cellular phone applications. Chief among them are the application processors in the EMMA Mobile and SH-Mobile series, devices that support full HD video processing, and the solutions in the Medity and SH-Mobile G series, chips that combine a baseband processor and an SH-Mobile processor in a single package. Our High-Power Amplifier (HPA) modules support the wireless communication standards used worldwide, and we also offer RFICs. Additionally, Renesas Electronics also produces sub-MCU products that support pedometer, touch-key, and other cellular phone functions.

System Block Diagram

Recommended products

BlockSemiconductor deviceRecommended productsFeatures, etc.
Baseband/
application
Microprocessor EMMA Mobile Series Multi core, Lower power consumption
Medity Series Base Band/application integrated chip
SH-Mobile G Series High performance, low power consumption
SH-Mobile Series High performance, low power consumption
RFIC GSM RFIC B6PLE GPRS/EDGE
WCDMA RFIC B7WG W-CDMA
GSM/WCDMA RFIC B8WGE Low power consumption, smaller
HPA GSM HPA module RPF08165B GPRS
RPF59001B EDGE
RPF88143B Built-in ANT SW
WCDMA HPA module RPF57711B W-CDMA
Camera Motor driver IC R2A304xxBM Smaller, thinner, and lower power consumption
Camera front-end IC R2J450xx Series, other High-precision, high function, lower power consumption
EEPROM R1EX24xxx Series I2C-bus interface *1
R1EX25xxx Series SPI-bus interface *2
Touch panel sensor Sub MCU 78K0/Kx2-L Lower power consumption, Bulit-in Op-amp.
R8C Family Lower power consumption, Touch Key
Ambient Illuminance Sensor PH5502B2NA1 Analog linear output
PH5551A2NA1 Digital output, I2C bus interface *1
Security Secure MCU for U-SIM AE/RS Series CPU with proprietary architecture & encryption coprocessor emphazing security
Discrete Zener diode
(Small Capacitance)
RKZxxKP, RKZxxKL Series Lower power consumption, small package
Schottky Barrier Diode RKRxxA/B Series High speed switching, Noise cut
PowerMOS FETμPA2550 Pch-Dual, Small package
μPA2630/2631/2672/2670Pch-Single/Dual
Small package, Low on-state resistance
μPA2600/2601/2660Nch-Single/Dual
Small package, Low on-state resistance
μPA2690
NP Complementary
Small package, Low on-state resistance
RF switch IC GaAs SWIC μPGxxxx Series Low loss, high isolation, ultra-small package, low power consumption

*1 I2C : Inter-Integrated Circuit
*2 SPI : Serial Peripheral Interface

■If you do not see the information you need here, please contact us via the link below.

Contact us

PDF version
(recommended for printing)
.

Technical Information WEB Magazine RENESAS EDGE


End of content

Back To Top