Cellular Phone
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Overview
New models of cellular phones are expected to provide ever more sophisticated functionality as communication speeds increase, camera pixel counts rise, LCD displays increase in size and resolution. There is a growing demand for features such as the ability to receive and record 1seg TV broadcasts and to handle electronic distribution of video and audio content. Consequently, low power consumption is critical in order to maintain adequate operating time when the user is communicating or the phone is in standby mode. Also, the control functions must be compact so handsets can be thinner and weigh less.
Renesas Electronics supplies a broad lineup of products for cellular phone applications. Chief among them are the application processors in the EMMA Mobile and SH-Mobile series, devices that support full HD video processing, and the solutions in the Medity and SH-Mobile G series, chips that combine a baseband processor and an SH-Mobile processor in a single package. Our High-Power Amplifier (HPA) modules support the wireless communication standards used worldwide, and we also offer RFICs. Additionally, Renesas Electronics also produces sub-MCU products that support pedometer, touch-key, and other cellular phone functions.
System Block Diagram
Recommended products
| Block | Semiconductor device | Recommended products | Features, etc. |
|---|---|---|---|
| Baseband/ application | Microprocessor | EMMA Mobile Series | Multi core, Lower power consumption |
| Medity Series | Base Band/application integrated chip | ||
| SH-Mobile G Series | High performance, low power consumption | ||
| SH-Mobile Series | High performance, low power consumption | ||
| RFIC | GSM RFIC | B6PLE | GPRS/EDGE |
| WCDMA RFIC | B7WG | W-CDMA | |
| GSM/WCDMA RFIC | B8WGE | Low power consumption, smaller | |
| HPA | GSM HPA module | RPF08165B | GPRS |
| RPF59001B | EDGE | ||
| RPF88143B | Built-in ANT SW | ||
| WCDMA HPA module | RPF57711B | W-CDMA | |
| Camera | Motor driver IC | R2A304xxBM | Smaller, thinner, and lower power consumption |
| Camera front-end IC | R2J450xx Series, other | High-precision, high function, lower power consumption | |
| EEPROM | R1EX24xxx Series | I2C-bus interface *1 | |
| R1EX25xxx Series | SPI-bus interface *2 | ||
| Touch panel sensor | Sub MCU | 78K0/Kx2-L | Lower power consumption, Bulit-in Op-amp. |
| R8C Family | Lower power consumption, Touch Key | ||
| Ambient Illuminance Sensor | PH5502B2NA1 | Analog linear output | |
| PH5551A2NA1 | Digital output, I2C bus interface *1 | ||
| Security | Secure MCU for U-SIM | AE/RS Series | CPU with proprietary architecture & encryption coprocessor emphazing security |
| Discrete | Zener diode (Small Capacitance) | RKZxxKP, RKZxxKL Series | Lower power consumption, small package |
| Schottky Barrier Diode | RKRxxA/B Series | High speed switching, Noise cut | |
| PowerMOS FET | μPA2550 | Pch-Dual, Small package | |
| μPA2630/2631/2672/2670 | Pch-Single/Dual Small package, Low on-state resistance | ||
| μPA2600/2601/2660 | Nch-Single/Dual Small package, Low on-state resistance | ||
| μPA2690 | NP Complementary Small package, Low on-state resistance | ||
| RF switch IC | GaAs SWIC | μPGxxxx Series | Low loss, high isolation, ultra-small package, low power consumption |
*1 I2C : Inter-Integrated Circuit
*2 SPI : Serial Peripheral Interface
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