Japan English
The following page content corresponds to the products marketed in Japan.
If you do not live in Japan, please
Overview
Bluetooth wireless technology enables short-range wireless communication. Unlike conventional remote control technologies, Bluetooth communication can be achieved between devices even when an obstruction presents, making it suitable for cases where constant connection is desired. Bluetooth is used in a variety of settings including earphones for mobile phones, headphones for portable digital music players, in-vehicle hands-free communication, and the direct sending of images to a printer or digital photo frame without using a PC. It has become an indispensable communication technology for digital devices that are equipped with networking function.
Renesas offers a Bluetooth module that uses the Host Controller Interface (HCI), to provide solutions for the development of Bluetooth applications with Renesas microcontrollers.
Renesas SH, M16C, H8S, RX, and other microcontrollers support the low power consumption that is essential to wireless devices, allowing you to choose the optimal microcontroller for your system.
* Bluetooth and the Bluetooth logo are registered trademarks of Bluetooth SIG, Inc. (USA) and are being used by Renesas Electronics under license.
System Block Diagram
Bluetooth Applications
Recommended Products
| Block | Semiconductor device | Recommended products | Features, etc. |
|---|---|---|---|
| Control MCU | MCU | SH7261 Group | 120 MHz, 144-pin LQFP, ROMless, 32 KB RAM SSI, I2C bus interface *1, SCIF |
| SH7262 Group | 144 MHz, 176-pin QFP, ROMless, 1088 KB RAM USB 2.0 Host or Function, NAND flash interface, SDHI *3, I2C bus interface *1, VDC3, SRC *2, SCIF | ||
| SH7263 Group | 200 MHz, 240-pin QFP, ROMless, 80 KB RAM USB 2.0 Host or Function, SSI, NAND flash interface, SDHI *3, I2C bus interface *1, SRC *2, SCIF, LCDC *4 | ||
| SH7264 Group | 144 MHz, 208-pin QFP, ROMless, 1088 KB RAM USB 2.0 Host or Function, SSI, NAND flash interface, SDHI *3, I2C bus interface *1, VDC3, SRC *2, SCIF | ||
| SH7265 Group | 200 MHz, 272-pin BGA, ROMless, 96 KB RAM USB 2.0 Host or Function, SSI, NAND flash interface, SDHI *3, I2C bus interface *1, SRC *2, SCIF, ATAPI *5 |
*1 I2C: Inter-Integrated Circuit
*2 SRC: Sampling Rate Converter
*3 SDHI: SD Host Interface
*4 LCDC: Liquid Crystal Display Control
*5 ATAPI: AT Attachment Packet Interface
Related Boards
| Name | Part No. |
|---|---|
| Optional board for audio | M3A-HS64G01 |
| SH7263 CPU board | R0K572630D001BR |
| SH7264 CPU board | M3A-HS64G50 |
Related Middleware
| Name | Part No. |
|---|---|
| Bluetooth host stack * | - |
| Sound middleware (MP3, AAC, WMA) | - |
*： Please contact your sales representative or contact us directly.
■If you do not see the information you need here, please contact us via the link below.
Contact us
PDF version
(recommended for printing)
.
