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Power Window
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Overview
The main (driver side) MCU of a power window or door unit requires CAN/LIN networking capabilities, and the sub-MCU (passenger side/back) must support LIN networking. In addition, high-speed operation performance is needed to implement automatic-reversing safety functions. Renesas offers a broad lineup of compact, high-performance MCUs that meet these requirements. For further compactness, we supply custom ASIC products that incorporate power supply, communication driver, and other functions in a single package as well as MCUs with integrated regulator and LIN driver functions.
System Block Diagram
Recommended Products
| MCU | Recommended Products | ROM [Byte] | RAM [Byte] | Operating Frequency [MHz] | Package [Pin] | Features |
|---|---|---|---|---|---|---|
| Main MCU | RL78/F12 | 8K-64K | 0.5K-4K | 32 | 20-64 | PWM output, 10-bit ADC, LIN, Ta = 150 support |
| 78K0R/Fx3 | 24K-256K | 1.5K-16K | 24 | 30-100 | 16K-Data Flash, PWM output, 10bit ADC, CAN, LIN | |
| 78K0/Fx2 | 32K-128K | 2K-7K | 20 | 44-80 | PWM output, 10bit ADC, CAN, LIN | |
| 78K0/Fx2-L | 8K-16K | 512-7K | 16-30 | PWM output, 10bit ADC, LIN | ||
| 78K0/Kx2 | 8K-128K | 384-768 | 30-80 | PWM output, 10bit ADC, LIN | ||
| 78K0/Kx2_LIN MCP** | 16K-60K | 768-3K | 48-64 | PWM output, 10-bit ADC, LIN transceiver, power supply | ||
| R8C/5x | 32K-128K | 2.5K-10K | 32 | 48-64 | PWM output, 10bit ADC, CAN, LIN, LQFP | |
| R8C/3x | 16K-128K | 1.5K-10K | 20 | 20-80 | ||
| Analog/Power Device | Recommended Product | Features | ||||
| Pre-driver and power IC for power door | R2A25108KFP* | 3-phase BL motor control, 48-pin LQFP | ||||
| Motor drive MOSFET for power doors | NP60N04KUG | 40V/60A/6.1mΩ/TO-263 | ||||
| NP60N055KUG | 55V/60A/9.4mΩ/TO-263 | |||||
| Motor drive MOSFET for power windows | NP52N055SUG | 55V/52A/14mΩ/TO-252 | ||||
| NP55N055SUG | 55V/55A/10mΩ/TO-252 | |||||
| CAN line ESD protection | NNCD-ST Series | Bidirectional ESD protection | ||||
| ESD protection | NNCD-DA Series(200mW) RD-FS Series(1W) | Surge protection | ||||
*:Under Development **MCP: Multi Chip Package
